On-chip dual-supply multi-mode cmos regulators

ABSTRACT

A method, an apparatus, and a computer program product are provided. The apparatus may be a regulator circuit. The regulator circuit includes a first voltage regulator to regulate a first input voltage to the first voltage regulator, the first voltage regulator including a P-type metal-oxide-semiconductor (PMOS), and a second voltage regulator to regulate a second input voltage to the second voltage regulator, the second voltage regulator including an N-type metal-oxide-semiconductor (NMOS). In an aspect, the first voltage regulator is coupled to the second voltage regulator.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional Application Ser.No. 62/005,765, entitled “ON-CHIP DUAL-SUPPLY MULTI-MODE CMOSREGULATORS” and filed on May 30, 2014, which is expressly incorporatedby reference herein in its entirety.

BACKGROUND

1. Field

The present disclosure relates generally to communication systems, andmore particularly, to a voltage regulator for a voltage controlledoscillator (VCO).

2. Background

A wireless device (e.g., a cellular phone or a smart phone) may transmitand receive data for two-way communication with a wireless communicationsystem. The wireless device may include a transmitter for datatransmission and a receiver for data reception. For data transmission,the transmitter may modulate a transmit local oscillator (LO) signalwith data to obtain a modulated radio frequency (RF) signal, amplify themodulated RF signal to obtain an output RF signal having the desiredoutput power level, and transmit the output RF signal via an antenna toa base station. For data reception, the receiver may obtain a receivedRF signal via the antenna, amplify and downconvert the received RFsignal with a receive LO signal, and process the downconverted signal torecover data sent by the base station.

The wireless device may include one or more oscillators to generate oneor more oscillator signals at one or more desired frequencies. Theoscillator signal(s) may be used to generate the transmit LO signal forthe transmitter and the receive LO signal for the receiver. Theoscillator(s) may be required to generate the oscillator signal(s) tomeet the requirements of the wireless communication system with whichthe wireless device communicates.

A VCO is used to generate the transmit LO signal and the receive LOsignal. A VCO is generally connected to a regulator that provides aninput voltage to the VCO. The performance of the VCO may depend on theregulator. Therefore, an effective regulator for the VCO is desired foroptimal performance and low noise.

SUMMARY

In an aspect of the disclosure, a method and an apparatus are provided.The apparatus may be a regulator circuit. The regulator circuit includesa first voltage regulator to regulate a first input voltage to the firstvoltage regulator, the first voltage regulator including a P-typemetal-oxide-semiconductor (PMOS), and a second voltage regulator toregulate a second input voltage to the second voltage regulator, thesecond voltage regulator including an N-type metal-oxide-semiconductor(NMOS). In an aspect, the first voltage regulator is coupled to thesecond voltage regulator. In an aspect, the regulator circuit mayfurther include a switch circuit to selectively activate at least one ofthe first voltage regulator or the second voltage regulator. In anaspect, the first voltage regulator and the second voltage regulator areconnected in series. In an aspect, the first voltage regulator and thesecond voltage regulator are connected in parallel. In an aspect, thefirst voltage regulator includes a two-stage amplifier circuit toamplify the first input voltage in two stages. In an aspect, the secondvoltage regulator circuit includes a-two-stage amplifier circuit toamplify the second input voltage in two stages. In an aspect, the secondvoltage regulator includes a pole-cancellation circuit. In an aspect,the second voltage regulator includes a capacitor and a resistor, andwherein one end of the resistor is connected to the capacitor andanother end of the resistor is connected to a source of the NMOS. In anaspect, the first voltage regulator and the second voltage regulator aretunable to change a degree of input voltage regulation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a wireless device communicating with differentwireless communication systems.

FIG. 2 is a block diagram of a wireless device.

FIG. 3 is an example circuit diagram of an NMOS regulator according tothe disclosure.

FIG. 4A is an example PSSR plot of PSSR values in various cases at aregulator.

FIG. 4B is an example noise plot of noise values in various cases.

FIG. 5 is an example implementation circuit of an NMOS regulatoraccording to the disclosure.

FIGS. 6A-6B are example structures of a CMOS regulator.

FIG. 7 is an example circuit diagram including a cascode CMOS regulator.

FIG. 8 is an example circuit diagram including a buffer circuit.

FIG. 9 is an example circuit structure at a system level according tothe disclosure.

FIG. 10A is an example PSSR plot of PSSR values in various cases at aVCO.

FIG. 10B is an example noise plot of noise values in various cases at aVCO.

FIG. 11 is a flow chart of a method by a regulator circuit.

FIG. 12 is a conceptual data flow diagram illustrating the data flowbetween different modules/means/components in an exemplary apparatus.

FIG. 13 is a diagram illustrating an example of a hardwareimplementation for an apparatus employing a processing system.

DETAILED DESCRIPTION

The detailed description set forth below in connection with the appendeddrawings is intended as a description of various configurations and isnot intended to represent the only configurations in which the conceptsdescribed herein may be practiced. The detailed description includesspecific details for the purpose of providing a thorough understandingof various concepts. However, it will be apparent to those skilled inthe art that these concepts may be practiced without these specificdetails. In some instances, well known structures and components areshown in block diagram form in order to avoid obscuring such concepts.The term “exemplary” is used herein to mean “serving as an example,instance, or illustration.” Any design described herein as “exemplary”is not necessarily to be construed as preferred or advantageous overother designs.

Several aspects of telecommunication systems will now be presented withreference to various apparatus and methods. These apparatus and methodswill be described in the following detailed description and illustratedin the accompanying drawings by various blocks, modules, components,circuits, steps, processes, algorithms, etc. (collectively referred toas “elements”). These elements may be implemented using electronichardware, computer software, or any combination thereof. Whether suchelements are implemented as hardware or software depends upon theparticular application and design constraints imposed on the overallsystem.

By way of example, an element, or any portion of an element, or anycombination of elements may be implemented with a “processing system”that includes one or more processors. Examples of processors includemicroprocessors, microcontrollers, digital signal processors (DSPs),field programmable gate arrays (FPGAs), programmable logic devices(PLDs), state machines, gated logic, discrete hardware circuits, andother suitable hardware configured to perform the various functionalitydescribed throughout this disclosure. One or more processors in theprocessing system may execute software. Software shall be construedbroadly to mean instructions, instruction sets, code, code segments,program code, programs, subprograms, software modules, applications,software applications, software packages, routines, subroutines,objects, executables, threads of execution, procedures, functions, etc.,whether referred to as software, firmware, middleware, microcode,hardware description language, or otherwise.

Accordingly, in one or more exemplary embodiments, the functionsdescribed may be implemented in hardware, software, firmware, or anycombination thereof. If implemented in software, the functions may bestored on or encoded as one or more instructions or code on acomputer-readable medium. Computer-readable media includes computerstorage media. Storage media may be any available media that can beaccessed by a computer. By way of example, and not limitation, suchcomputer-readable media can comprise random-access memory (RAM),read-only memory (ROM), electronically erasable programmable ROM(EEPROM), compact disk (CD) ROM (CD-ROM), or other optical disk storage,magnetic disk storage or other magnetic storage devices, or any othermedium that can be used to carry or store desired program code in theform of instructions or data structures and that can be accessed by acomputer. Disk and disc, as used herein, includes CD, laser disc,optical disc, digital versatile disc (DVD), and floppy disk where disksusually reproduce data magnetically, while discs reproduce dataoptically with lasers. Combinations of the above should also be includedwithin the scope of computer-readable media.

FIG. 1 is a diagram 100 illustrating a wireless device 110 communicatingwith different wireless communication systems 120, 122. The wirelesscommunication systems 120, 122 may each be a Code Division MultipleAccess (CDMA) system, a Global System for Mobile Communications (GSM)system, a Long Term Evolution (LTE) system, a wireless local areanetwork (WLAN) system, or some other wireless system. A CDMA system mayimplement Wideband CDMA (WCDMA), CDMA 1X or cdma2000, Time DivisionSynchronous Code Division Multiple Access (TD-SCDMA), or some otherversion of CDMA. TD-SCDMA is also referred to as Universal TerrestrialRadio Access (UTRA) Time Division Duplex (TDD) 1.28 Mcps Option or LowChip Rate (LCR). LTE supports both frequency division duplexing (FDD)and time division duplexing (TDD). For example, the wirelesscommunication system 120 may be a GSM system, and the wirelesscommunication system 122 may be a WCDMA system. As another example, thewireless communication system 120 may be an LTE system, and the wirelesscommunication system 122 may be a CDMA system.

For simplicity, the diagram 100 shows the wireless communication system120 including one base station 130 and one system controller 140, andthe wireless communication system 122 including one base station 132 andone system controller 142. In general, each wireless system may includeany number of base stations and any set of network entities. Each basestation may support communication for wireless devices within thecoverage of the base station. The base stations may also be referred toas a Node B, an evolved Node B (eNB), an access point, a basetransceiver station, a radio base station, a radio transceiver, atransceiver function, a basic service set (BSS), an extended service set(ESS), or some other suitable terminology. The wireless device 110 mayalso be referred to as a user equipment (UE), a mobile device, a remotedevice, a wireless device, a wireless communications device, a station,a mobile station, a subscriber station, a mobile subscriber station, aterminal, a mobile terminal, a remote terminal, a wireless terminal, anaccess terminal, a client, a mobile client, a mobile unit, a subscriberunit, a wireless unit, a remote unit, a handset, a user agent, or someother suitable terminology. The wireless device 110 may be a cellularphone, a smartphone, a tablet, a wireless modem, a personal digitalassistant (PDA), a handheld device, a laptop computer, a smartbook, anetbook, a cordless phone, a wireless local loop (WLL) station, or someother similar functioning device.

The wireless device 110 may be capable of communicating with thewireless communication system 120 and/or 122. The wireless device 110may also be capable of receiving signals from broadcast stations, suchas the broadcast station 134. The wireless device 110 may also becapable of receiving signals from satellites, such as the satellite 150,in one or more global navigation satellite systems (GNSS). The wirelessdevice 110 may support one or more radio technologies for wirelesscommunication such as GSM, WCDMA, cdma2000, LTE, 802.11, etc. The terms“radio technology,” “radio access technology,” “air interface,” and“standard” may be used interchangeably.

The wireless device 110 may communicate with a base station in awireless system via the downlink and the uplink. The downlink (orforward link) refers to the communication link from the base station tothe wireless device, and the uplink (or reverse link) refers to thecommunication link from the wireless device to the base station. Awireless system may utilize TDD and/or FDD. For TDD, the downlink andthe uplink share the same frequency, and downlink transmissions anduplink transmissions may be sent on the same frequency in different timeperiods. For FDD, the downlink and the uplink are allocated separatefrequencies. Downlink transmissions may be sent on one frequency, anduplink transmissions may be sent on another frequency. Some exemplaryradio technologies supporting TDD include GSM, LTE, and TD-SCDMA. Someexemplary radio technologies supporting FDD include WCDMA, cdma2000, andLTE. The wireless device 110 and/or the base stations 130, 132 mayinclude an exemplary VCO regulator 160. A VCO regulator 160 is providedinfra.

FIG. 2 is a block diagram 200 of an exemplary wireless device, such asthe wireless device 110. The wireless device includes a dataprocessor/controller 210, a transceiver 218, and an antenna 290. Thedata processor/controller 210 may be referred to as a processing system.A processing system may include the data processor/controller 210 orboth the data processor/controller 210 and the memory 216. Thetransceiver 218 includes a transmitter 220 and a receiver 250 thatsupport bi-directional communication. The transmitter 220 and/or thereceiver 250 may be implemented with a super-heterodyne architecture ora direct-conversion architecture. In the super-heterodyne architecture,a signal is frequency converted between RF and baseband in multiplestages, e.g., from RF to an intermediate frequency (IF) in one stage,and then from IF to baseband in another stage for a receiver. In thedirect-conversion architecture, which is also referred to as a zero-IFarchitecture, a signal is frequency converted between RF and baseband inone stage. The super-heterodyne and direct-conversion architectures mayuse different circuit blocks and/or have different requirements. In theexemplary design shown in FIG. 2, the transmitter 220 and the receiver250 are implemented with the direct-conversion architecture.

In the transmit path, the data processor/controller 210 may process(e.g., encode and modulate) data to be transmitted and provide the datato a digital-to-analog converter (DAC) 230. The DAC 230 converts adigital input signal to an analog output signal. The analog outputsignal is provided to a transmit (TX) baseband (lowpass) filter 232,which may filter the analog output signal to remove images caused by theprior digital-to-analog conversion by the DAC 230. An amplifier (amp)234 may amplify the signal from the TX baseband filter 232 and providean amplified baseband signal. An upconverter (mixer) 236 may receive theamplified baseband signal and a TX LO signal from a TX LO signalgenerator 276. The upconverter 236 may upconvert the amplified basebandsignal with the TX LO signal and provide an upconverted signal. A filter238 may filter the upconverted signal to remove images caused by thefrequency upconversion. A power amplifier (PA) 240 may amplify thefiltered RF signal from the filter 238 to obtain the desired outputpower level and provide an output RF signal. The output RF signal may berouted through a duplexer/switchplexer 264.

For FDD, the transmitter 220 and the receiver 250 may be coupled to theduplexer 264, which may include a TX filter for the transmitter 220 anda receive (RX) filter for the receiver 250. The TX filter may filter theoutput RF signal to pass signal components in a transmit band andattenuate signal components in a receive band. For TDD, the transmitter220 and the receiver 250 may be coupled to switchplexer 264. Theswitchplexer 264 may pass the output RF signal from the transmitter 220to the antenna 290 during uplink time intervals. For both FDD and TDD,the duplexer/switchplexer 264 may provide the output RF signal to theantenna 290 for transmission via a wireless channel.

In the receive path, the antenna 290 may receive signals transmitted bybase stations and/or other transmitter stations and may provide areceived RF signal. The received RF signal may be routed throughduplexer/switchplexer 264. For FDD, the RX filter within the duplexer264 may filter the received RF signal to pass signal components in areceive band and attenuate signal components in the transmit band. ForTDD, the switchplexer 264 may pass the received RF signal from theantenna 290 to the receiver 250 during downlink time intervals. For bothFDD and TDD, the duplexer/switchplexer 264 may provide the received RFsignal to the receiver 250.

Within the receiver 250, the received RF signal may be amplified by alow noise amplifier (LNA) 252 and filtered by a filter 254 to obtain aninput RF signal. A downconverter (mixer) 256 may receive the input RFsignal and an RX LO signal from an RX LO signal generator 286. Thedownconverter 256 may downconvert the input RF signal with the RX LOsignal and provide a downconverted signal. The downconverted signal maybe amplified by an amplifier 258 and further filtered by an RX baseband(lowpass) filter 260 to obtain an analog input signal. The analog inputsignal is provided to an analog-to-digital converter (ADC) 262. The ADC262 converts an analog input signal to a digital output signal. Thedigital output signal is provided to the data processor/controller 210.

A TX frequency synthesizer 270 may include a TX phase locked loop (PLL)272 and a VCO 274. The VCO 274 may generate a TX VCO signal at a desiredfrequency. The TX PLL 272 may receive timing information from the dataprocessor/controller 210 and generate a control signal for the VCO 274.The control signal may adjust the frequency and/or the phase of the VCO274 to obtain the desired frequency for the TX VCO signal. The TXfrequency synthesizer 270 provides the TX VCO signal to the TX LO signalgenerator 276. The TX LO signal generator may generate a TX LO signalbased on the TX VCO signal received from the TX frequency synthesizer270.

A RX frequency synthesizer 280 may include an RX PLL 282 and a VCO 284.The VCO 284 may generate an RX VCO signal at a desired frequency. The RXPLL 282 may receive timing information from the dataprocessor/controller 210 and generate a control signal for the VCO 284.The control signal may adjust the frequency and/or the phase of the VCO284 to obtain the desired frequency for the RX VCO signal. The RXfrequency synthesizer 280 provides the RX VCO signal to the RX LO signalgenerator 286. The RX LO signal generator may generate an RX LO signalbased on the RX VCO signal received from the RX frequency synthesizer280.

The LO signal generators 276, 286 may each include frequency dividers,buffers, etc. The LO signal generators 276, 286 may be referred to asfrequency dividers if they divide a frequency provided by the TXfrequency synthesizer 270 and the RX frequency synthesizer 280,respectively. The PLLs 272, 282 may each include a phase/frequencydetector, a loop filter, a charge pump, a frequency divider, etc. EachVCO signal and each LO signal may be a periodic signal with a particularfundamental frequency. The TX LO signal and the RX LO signal from the LOsignal generators 276, 286 may have the same frequency for TDD ordifferent frequencies for FDD. The TX VCO signal and the RX VCO signalfrom the VCOs 274, 284 may have the same frequency (e.g., for TDD) ordifferent frequencies (e.g., for FDD or TDD).

The conditioning of the signals in the transmitter 220 and the receiver250 may be performed by one or more stages of amplifier, filter,upconverter, downconverter, etc. These circuits may be arrangeddifferently from the configuration shown in FIG. 2. Furthermore, othercircuits not shown in FIG. 2 may also be used to condition the signalsin the transmitter 220 and the receiver 250. For example, impedancematching circuits may be located at the output of the PA 240, at theinput of the LNA 252, between the antenna 290 and theduplexer/switchplexer 264, etc. Some circuits in FIG. 2 may also beomitted. For example, the filter 238 and/or the filter 254 may beomitted. All or a portion of the transceiver 218 may be implemented onone or more analog integrated circuits (ICs), RF ICs (RFICs),mixed-signal ICs, etc. For example, the TX baseband filter 232 to the PA240 in the transmitter 220, the LNA 252 to the RX baseband filter 260 inthe receiver 250, the PLLs 272, 282, the VCOs 274, 284, and the LOsignal generators 276, 286 may be implemented on an RFIC. The PA 240 andpossibly other circuits may also be implemented on a separate IC or acircuit module.

The data processor/controller 210 may perform various functions for thewireless device. For example, the data processor/controller 210 mayperform processing for data being transmitted via the transmitter 220and received via the receiver 250. The data processor/controller 210 maycontrol the operation of various circuits within the transmitter 220 andthe receiver 250. The memory 212 and/or the memory 216 may store programcodes and data for the data processor/controller 210. The memory may beinternal to the data processor/controller 210 (e.g., the memory 212) orexternal to the data processor/controller 210 (e.g., the memory 216).The memory may be referred to as a computer-readable medium. Anoscillator 214 may generate a VCO signal at a particular frequency. Aclock generator 215 may receive the VCO signal from the oscillator 214and may generate clock signals for various modules within the dataprocessor/controller 210. The data processor/controller 210 may beimplemented on one or more application specific integrated circuits(ASICs) and/or other ICs.

Frequency dividers, such as the frequency dividers in LO signalgenerators 276, 286, are used extensively for generating LO signals.There is a need for a programmable frequency divider for generating LOsignals in multi-band cellular transceivers that meets stringent LOrequirements such as small chip area, good phase noise requirement, andquadrature output.

A VCO (e.g., VCO 274 or VCO 284 of FIG. 2) is sensitive to noise spikesand spurs. Thus, a power management integrated circuit (PMIC) isgenerally used for the VCO to address such an issue. Based on a PMICnoise/spur profile, a power supply rejection ratio (PSRR) of at least 40dB at 1 MHz is generally desired. For example, a spur (e.g., a spike) ofnoise is observed between 100 kHz and 1 MHz in the PMIC noise/spurprofile. Thus, there is a demand for an effective VCO regulator that iscapable of providing a good bandwidth (e.g., a wide bandwidth) andattenuating the spur (e.g., the large spike) for the VCO. It is notedthat, although a wider PSRR bandwidth may provide improved performanceof a VCO regulator, increasing the PSRR bandwidth may also cause thenoise bandwidth to increase. Therefore, there is a trade-off betweenincreasing the PSRR bandwidth and increasing noise bandwidth that is notdesirable.

For a VCO to obtain desired power/phase noise conditions, the VCO mayimplement a VCO regulator with a dual supply configuration to supplyvoltage. The dual supply configuration may alleviatesupply/electromagnetic pulling of the VCO. For example, the dual voltagesupply configuration may supply high voltage (HV) for a GSM mode and maysupply low voltage (LV) for a non-GSM mode (e.g., for CDMA, LTE, etc.).For an LV non-GSM mode, a specific LV PSRR for low voltage is a concernfor satisfactory performance of a VCO regulator because the voltagesupplied to the VCO regulator is low in the LV non-GSM mode. Forexample, in the LV non-GSM mode supplying low voltage, to mitigate PMICpulse-frequency modulation (PFM) spurs, a VCO regulator should providean LV PSRR of approximately 100 dB in several hundreds KHz to MHz rangewith dropout voltage of less than 100 mV. Example simulation resultsillustrate that for the LV non-GSM mode, a PSRR of approximately 100 dBis desired at 100 KHz to mitigate the PMIC PFM spurs. For an HV GSMmode, good noise performance is a concern for satisfactory performanceof a VCO regulator because a high voltage supplied to the VCO regulatormay increase the noise bandwidth. For example, in the HV GSM modesupplying high voltage, the VCO regulator provides a certain PSRR at afrequency of several tens of MHz range, while maintaining low noise forthe high voltage.

It is desired that a VCO regulator be programmable (e.g., tunable) tosatisfy various PSRR/noise specifications and to adapt to the tradeoffbetween the PSRR and the noise. For example, the VCO regulator should beprogrammable to provide different PSRR and noise characteristics fordifferent uses. Thus, for example, the VCO regulator should beprogrammable to provide different PSRR and noise characteristicsdepending on whether the mode is the LV mode or the HV mode.

It is noted that performance of the VCO regulator is related to a typeof a pass element (e.g., DC bias, input/output impedance). In general,an N-type metal-oxide-semiconductor (NMOS) regulator is limited by a DCbias condition and a P-type metal-oxide-semiconductor (PMOS) regulatorhas a worse PSRR than the NMOS regulator. Table 1 illustrates comparisonbetween an NMOS regulator and a PMOS regulator. In Table 1, a number ofplus signs (+) represents a degree of desirable performance, and anumber of minus signs (−) represents a degree of undesirableperformance.

TABLE 1 Comparison between an NMOS regulator and a PMOS regulator PSRRPSRR Rin Rin Regulator @low @high @low @high type freq. freq. freq freqArea Noise NMOS + + + + + + + − + 1VDD NMOS + + + + + + − + 2VDDPMOS + + − − + − + + − 1VDD PMOS − − − + − + + − 2VDD

The NMOS regulator according to the disclosure implements a two-stageoperational transconductance amplifier (OTA) circuit to obtain adesirable PSRR (e.g., 100 dB). The two-stage OTA circuit may limit thebandwidth to obtain 100 dB at 100 kHz via a compensation network. Thecompensation network in the two-stage OTA circuit also provides polecancellation. FIG. 3 is an example circuit diagram 300 of an NMOSregulator according to the disclosure. The NMOS regulator 300 includesan NMOS 302. The NMOS 302 has a source (S), a drain (D), and a gate (G).The NMOS regulator 300 includes a first amplifier 304 and a secondamplifier 306 to provide a two-stage OTA circuit. The second amplifier306 may be a common source amplifier. For example, a PSSR of 60-70 dBmay be achieved in the first stage through the first amplifier 304, anda PSSR of 30-40 dB may be achieved in the second stage through thesecond amplifier 306, thereby achieving a total PSSR of approximately100 dB for the two-stage OTA circuit. An output of the first amplifier304 is connected to an input of the second amplifier 306, and the outputof the second amplifier 306 is connected to the gate (G) of the NMOS302. The output of the first amplifier 304 is also connected to acapacitor 308 with capacitance CM at a first end of the capacitor 308. Asecond end of the capacitor 308 is connected to a first end of aresistor 310 with resistance RM. A second end of the resistor 310 isconnected to the source (S) of the NMOS 302 and a VCO 350. The VCO 350may be equivalent to the VCO 274 or the VCO 284 of FIG. 2.

The capacitor 308 and the resistor 310 form a compensation network tocompensate the regulator output 312 to the output of the first stage OTAcircuit including the first amplifier 304. The capacitor 308 and theresistor 310 may be matched with transconductance (Gm) of the firststage OTA circuit. For example, the compensation network including thecapacitor 308 and the resistor 310 may be tunable to match with the Gmof the first stage OTA circuit for stability and to minimize noise. Itis noted that both the compensation network and the first stage OTAcircuit are tunable to match with each other. Because at least one ofthe compensation network or the first stage OTA circuit is tunable, theregulator can maintain good stability, good regulator bandwidth, andlower noise. It is noted that, if the first stage OTA Gm is larger, thecompensation network provides a stronger compensation, and thus providesbetter stability.

The following equations provide computation of the PSRR according to theexample illustrated in FIG. 3. A_(path) is a gain through A_(path) shownin FIG. 3. s is jω. A is a DC gain from a supply to the regulator output312. A2 is a DC gain at the second amplifier 306. ro1 is outputresistance of the first amplifier 304. ω_(p1) is a pole at the output ofthe first amplifier 304, ω_(p2) is a pole at the output of the secondamplifier 306, and ω_(p3) is a pole at the output 312 of the NMOSregulator. ω_(z) is a zero generated by the compensation network withthe resistor 310 and the capacitor 308. A_(LP) is an open loop DC gainfrom the input of first amplifier 304 to the regulator output 312.

$\begin{matrix}{{A_{path} \approx \frac{A\left( {1 + \frac{s}{\omega_{z}}} \right)}{1 + \frac{s}{\omega_{p\; 1}}}},{\omega_{p\; 1} = \frac{1}{A\; {2 \cdot {CM} \cdot {ro}}\; 1}},{\omega_{z} = \frac{1}{{{CM} \cdot {ro}}\; 1}}} & (1) \\{{LoopGain} \approx \frac{A_{LP}}{\left( {1 + \frac{s}{\omega_{p\; 1}}} \right)\left( {1 + \frac{s}{\omega_{p2}}} \right)\left( {1 + \frac{s}{\omega_{p\; 3}}} \right)}} & (2)\end{matrix}$

FIG. 4A is an example PSSR plot 400 of PSSR values in various cases at aregulator. The PSSR plot 400 illustrates that the pole cancellation (PC)2-stage OTA regulator circuit provides a PSSR plot that is closer to thedesirable PSSR of −100 dB than the PSSR plots of a 1-stage OTA regulatorand a conventional 2-stage OTA regulator. Thus, the pole cancellationprovided by the 2-stage OTA regulator circuit of the disclosure (e.g.,via the NMOS regulator of FIG. 3) helps extend the bandwidth of thePSSR. The more power the 2-stage OTA regular circuit provides, the widerthe PSSR bandwidth is. FIG. 4B is an example noise plot 450 of noisevalues in various cases. According to the example noise plot 450, thenoise plot of the PC 2-stage OTA regulator circuit is similar to thenoise plots of a 1-stage OTA regulator and a conventional 2-stage OTAregulator, except for a portion 452. The portion 452 of the examplenoise plot 450 is zoomed to a zoomed portion 454. The zoomed portion 454indicates that both the PC 2-stage OTA regulator circuit and theconventional 2-stage OTA regular circuit experience slightly highernoise than the 1-stage OTA regular circuit.

FIG. 5 is an example implementation circuit 500 of the NMOS regulatoraccording to the disclosure. The NMOS regulator 500 includes a two-stageOTA circuit 502 including two OTAs and a compensation network includinga resistor and a capacitor. In an aspect, the two-stage OTA circuit 502may be equivalent to the two-stage OTA circuit including the firstamplifier 304 and the second amplifier 306 in FIG. 3. In an aspect, thecompensation network 504 may be equivalent to the compensation networkincluding the capacitor 308 and the resistor 310 in FIG. 3. Thecompensation network 504 may be tunable to match with a first stage OTAcircuit of the two-stage OTA circuit 502.

According to the disclosure, a regulator circuit may be a complementarymetal-oxide-semiconductor (CMOS) regulator circuit that includes a PMOSregulator and an NMOS regulator, where the NMOS regulator is coupled tothe PMOS regulator. In one aspect, the PMOS regulator may be connectedto the NMOS regulator in series (in cascode). In another aspect, thePMOS regulator may be connected to the NMOS regulator in parallel. Theregulator circuit may be connected to a switch circuit to selectivelychoose an HV mode or an LV mode for the CMOS regulator circuit. Ingeneral, for the VCO, the HV mode may be used for better performance interms of less pulling effect and better phase noise performance.However, the HV mode may cause higher power consumption. The LV modegenerally causes lower power consumption than the HV mode. It is notedthat the VCO is less sensitive to electromagnetic (EM) coupling in theHV mode. In one aspect, the switch circuit may select the HV mode forthe PMOS regulator and bypass the NMOS regulator. In another aspect, forthe LV mode, the switch circuit may select either the NMOS regulator andbypass the PMOS regulator, or may select both the PMOS regulator and theNMOS regulator. In addition, it is noted that the PMOS regulator and theNMOS regulator have different input impedance and output impedance. ThePMOs regulator generally has lower input impedance and higher outputimpedance than the NMOS regulator. Thus, in one aspect, the switchcircuit may be used to select either the PMOS regulator or the NMOSregulator, depending on whether the VCO is an aggressor or a victim tosurrounding building blocks. For example, the switch circuit may selectthe PMOS regulator if the VCO is an aggressor that may affect thesurrounding building blocks (e.g., by pulling the surrounding buildingblocks). For example, the switch circuit may select the NMOS regulatorif the VCO is a victim that may be affected by the surrounding buildingblocks (e.g., by being pulled by the surrounding building blocks). It isfurther noted that selecting both the PMOS regulator and the NMOSregulator that are connected in series would also provide isolation fromaffecting and/or being affected from the surrounding building blocks.

FIGS. 6A-6B are example structures of a CMOS regulator. FIG. 6A is anexample structure 600 of a CMOS regulator where a PMOS regulator 604 andan NMOS regulator 606 are connected in series. In particular, a switchcircuit 602 is connected to the PMOS regulator 604 that is connected tothe NMOS regulator 606 in series. The switch circuit 602 is configuredto select one of an LV mode and an HV mode. As discussed supra, forexample, the LV mode is used to supply low voltage for a non-GSM mode,and the HV mode is used to supply high voltage for a GSM mode. Althoughnot shown, in another example, the order of the PMOS regulator 604 andthe NMOS regulator 606 may be different from the example structure 600of FIG. 6A. The CMOS regulator includes a PMOS regulator and an NMOSregulator. FIG. 6B is an example structure 650 of a CMOS regulator wherea PMOS regulator 654 and an NMOS regulator 658 are connected inparallel. In particular, a first switch circuit 652 is connected to thePMOS regulator 654 and a second switch circuit 656 is connected to theNMOS regulator 658, where the PMOS regulator 654 and the NMOS regulator658 are connected in parallel. As discussed supra, for example, the LVmode is used to supply low voltage for a non-GSM mode, and the HV modeis used to supply high voltage for a GSM mode. Thus, if the LV mode isused, both the first switch circuit 652 and the second switch circuit656 are configured to provide low voltage. If the HV mode is used, boththe first switch circuit 652 and the second switch circuit 656 areconfigured to provide high voltage.

FIG. 7 is an example circuit diagram 700 including a cascode CMOSregulator. In particular, a switch circuit 710 is connected to a CMOSregulator that includes a PMOS regulator 730 and an NMOS regulator 750,where the PMOS regulator 730 and the NMOS regulator 750 are connected inseries (cascode). The CMOS regulator is connected to a VCO circuit 770via the NMOS regulator 750. The VCO circuit 770 may be equivalent to theVCO 274 or the VCO 284 of FIG. 2. The VCO circuit 770 may have a lowfrequency (LF) VCO output at 772 and a high frequency (HF) VCO output at774. In an aspect, the switch circuit 710 may selectively supply eithera voltage of an HV mode or a voltage of an LV mode for the CMOSregulator. In the example of FIG. 7, the switch circuit 710 may supplythe HV mode voltage of 1.6V or the LV mode voltage of 0.95V to the CMOSregulator. The switch circuit 710 may selectively supply either avoltage of the HV mode or a voltage of the LV mode depending on variousfactors such as following. The HV mode may provide better VCO phasenoise and swing as well as better VCO buffer phase noise and swing thanthe LV mode. The LV mode may cause lower power consumption than the HVmode. The supply voltage domain of the voltage supplied to the CMOSregulator may be configured to experience less supply coupling. It isalso noted that the VCO is less sensitive to EM coupling in the HV modethan in the LV mode.

In an aspect, the NMOS regulator 750 has a better PSRR at 100 MHz thanthe PMOS regulator 730. In an aspect, the PMOS regulator 730 may havebetter noise performance (e.g., lower noise) at 100 MHz (e.g., in GSM,HV and low PMOS regulator BW) than the NMOS regulator 750. In theexample of FIG. 7, the PMOS regulator 730 can output Vdd=−50 mV. In theexample of FIG. 7, the NMOS regulator 750 can achieve a PSRR of 100 dBat 1 MHz with 100 mV drop-out. For example, the NMOS regulator 750 has atwo-stage OTA and pole cancellation features to achieve a PSRR of 100 dBat 1 MHz for PFM spurs.

FIG. 8 is an example circuit diagram 800 including a buffer circuit. Inthe example circuit diagram 800, a switch circuit 810 is connected to abuffer circuit 830. In an aspect, the switch circuit 810 may selectivelyprovide either an HV mode or an LV mode. The buffer circuit 830 receivesoutputs from the VCO, such as the VCO circuit 770 of FIG. 7, and buffersthe outputs. Thus, the buffer circuit 830 may be connected to the VCOcircuit 770 of FIG. 7. For example, the LF VCO input 832 into the buffercircuit 830 may be from the LF VCO output 772 of FIG. 7, and the HF VCOinput 834 into the buffer circuit 830 may be from the HF VCO output 774of FIG. 7.

FIG. 9 is an example circuit structure 900 at a system level accordingto the disclosure. The example circuit structure 900 includes atransmission (TX) VCO regulator 902, a first reception (RX) carrieraggregation (CA) regulator 904, and a second RX CA regulator 906. Thefirst RX CA regulator 904 is for receiving carrier aggregation at afirst frequency, and the second RX CA regulator 906 is for receivingcarrier aggregation at a second frequency. Each one of the TX VCOregulator 902, the first RX CA regulator 904, and the second RX CAregulator 906 includes a CMOS regulator structure having a PMOSregulator coupled to an NMOS regulator.

FIG. 10A is an example PSSR plot 1000 of PSSR values in various cases ata VCO. The PSSR plot 1000 illustrates that a 2-stage OTA regulatorcircuit provides a PSSR plot for the VCO that is closer to the desirablePSSR of −100 dB than the PSSR plots of a 1-stage OTA regulator. Thus,the PSRR of 100 dB at 100 kHZ is achieved by the 2-stage OTA regulator.Further, according to FIG. 10A, the VCO may also experience 50 dBimprovement when the 2-stage OTA regulator is used. FIG. 10B is anexample noise plot 1050 of noise values in various cases at a VCO.According to the example noise plot 1050, the noise plot of the 1-stageOTA regulator has spurs 1052 and 1054, whereas the noise plot of a2-stage OTA regulator does not have spurs. Thus, the VCO experiencesspur reduction when the 2-stage OTA regulator is used. In addition, ifthe VCO VDD switches to a high-supply domain, 4-5 dB reference side band(RSB) improvement may be provided.

FIG. 11 is a flow chart 1100 of a method by a regulator circuit. Themethod may be performed by a regulator circuit (e.g., the regulatorcircuit 600, 650, the apparatus 1202/1202′). At 1102, the regulatorcircuit regulates, via a first voltage regulator, a first input voltageto the first voltage regulator, the first voltage regulator including aPMOS. At 1104, the regulator circuit regulates, via a second voltageregulator, a second input voltage to the second voltage regulator, thesecond voltage regulator including an NMOS, where the first voltageregulator is connected to the second voltage regulator. At 1106, theregulator circuit selectively activates, via a switch circuit, at leastone of the first voltage regulator or the second voltage regulator. Inan aspect, the at least one of the first voltage regulator or the secondvoltage regulator is selectively activated based on noise.

FIG. 12 is a conceptual data flow diagram 1200 illustrating the dataflow between different modules/means/components in an exemplaryapparatus 1202. The apparatus may be a regulator circuit. The apparatusincludes a first voltage regulator module 1204, a second voltageregulator module 1206, and a switching module 1208.

The first voltage regulator module 1204 regulates a first input voltageto the first voltage regulator module 1204. In an aspect, the firstvoltage regulator module 1204 includes a PMOS. The second voltageregulator module 1206 regulates a second input voltage to the secondvoltage regulator module 1206. In an aspect, the second voltageregulator module 1206 includes an NMOS. In an aspect, the first voltageregulator is connected to the second voltage regulator. The switchingmodule 1208 selectively activates at least one of the first voltageregulator module 1204 or the second voltage regulator module 1206. In anaspect, the at least one of the first voltage regulator module 1204 orthe second voltage regulator 1206 is selectively activated based onnoise.

The apparatus may include additional modules that perform each of theblocks of the algorithm in the aforementioned flow charts of FIG. 11. Assuch, each block in the aforementioned flow charts of FIG. 11 may beperformed by a module and the apparatus may include one or more of thosemodules. The modules may be one or more hardware components specificallyconfigured to carry out the stated processes/algorithm, implemented by aprocessor configured to perform the stated processes/algorithm, storedwithin a computer-readable medium for implementation by a processor, orsome combination thereof.

FIG. 13 is a diagram 1300 illustrating an example of a hardwareimplementation for an apparatus 1202′ employing a processing system1314. The processing system 1314 may be implemented with a busarchitecture, represented generally by the bus 1324. The bus 1324 mayinclude any number of interconnecting buses and bridges depending on thespecific application of the processing system 1314 and the overalldesign constraints. The bus 1324 links together various circuitsincluding one or more processors and/or hardware modules, represented bythe processor 1304, the modules 1204, 1206, 1208, and thecomputer-readable medium/memory 1306. The bus 1324 may also link variousother circuits such as timing sources, peripherals, voltage regulators,and power management circuits, which are well known in the art, andtherefore, will not be described any further.

The processing system 1314 may be coupled to a transceiver 1310. Thetransceiver 1310 is coupled to one or more antennas 1320. Thetransceiver 1310 provides a means for communicating with various otherapparatus over a transmission medium. The transceiver 1310 receives asignal from the one or more antennas 1320, extracts information from thereceived signal, and provides the extracted information to theprocessing system 1314. In addition, the transceiver 1310 receivesinformation from the processing system 1314, and based on the receivedinformation, generates a signal to be applied to the one or moreantennas 1320. The processing system 1314 includes a processor 1304coupled to a computer-readable medium/memory 1306. The processor 1304 isresponsible for general processing, including the execution of softwarestored on the computer-readable medium/memory 1306. The software, whenexecuted by the processor 1304, causes the processing system 1314 toperform the various functions described supra for any particularapparatus. The computer-readable medium/memory 1306 may also be used forstoring data that is manipulated by the processor 1304 when executingsoftware. The processing system further includes at least one of themodules 1204, 1206, and 1208. The modules may be software modulesrunning in the processor 1304, resident/stored in the computer readablemedium/memory 1306, one or more hardware modules coupled to theprocessor 1304, or some combination thereof.

In one configuration, the apparatus 1202/1202′ includes means forregulating a first input voltage to the means for regulating the firstinput voltage, the means for regulating the first input voltageincluding a PMOS, means for regulating a second input voltage to themeans for regulating the second voltage, the means for regulating thesecond voltage including an NMOS, where the means for regulating thefirst input voltage is connected to the means for regulating the secondvoltage, and means for selectively activating at least one of the meansfor regulating the first input voltage or the means for regulating thesecond voltage. In an aspect, the means for selectively activating isconfigured to selectively activate at least one of the means forregulating the first input voltage or the means for regulating thesecond voltage based on noise. The aforementioned means may be one ormore of the aforementioned modules of the apparatus 1202 and/or theprocessing system 1314 of the apparatus 1202′ configured to perform thefunctions recited by the aforementioned means.

It is understood that the specific order or hierarchy of steps in theprocesses disclosed is an illustration of exemplary approaches. Basedupon design preferences, it is understood that the specific order orhierarchy of steps in the processes may be rearranged. Further, somesteps may be combined or omitted. The accompanying method claims presentelements of the various steps in a sample order, and are not meant to belimited to the specific order or hierarchy presented.

The previous description is provided to enable any person skilled in theart to practice the various aspects described herein. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother aspects. Thus, the claims are not intended to be limited to theaspects shown herein, but is to be accorded the full scope consistentwith the language claims, wherein reference to an element in thesingular is not intended to mean “one and only one” unless specificallyso stated, but rather “one or more.” Unless specifically statedotherwise, the term “some” refers to one or more. All structural andfunctional equivalents to the elements of the various aspects describedthroughout this disclosure that are known or later come to be known tothose of ordinary skill in the art are expressly incorporated herein byreference and are intended to be encompassed by the claims. Moreover,nothing disclosed herein is intended to be dedicated to the publicregardless of whether such disclosure is explicitly recited in theclaims. No claim element is to be construed as a means plus functionunless the element is expressly recited using the phrase “means for.”

What is claimed is:
 1. A regulator circuit, comprising: a first voltageregulator to regulate a first input voltage to the first voltageregulator, the first voltage regulator including a P-typemetal-oxide-semiconductor (PMOS); a second voltage regulator to regulatea second input voltage to the second voltage regulator, the secondvoltage regulator including an N-type metal-oxide-semiconductor (NMOS),wherein the first voltage regulator is connected to the second voltageregulator; and a switch circuit to selectively activate at least one ofthe first voltage regulator or the second voltage regulator.
 2. Theregulator circuit of claim 1, wherein the switch circuit selectivelyactivates at least one of the first voltage regulator or the secondvoltage regulator based on noise.
 3. The regulator circuit of claim 1,wherein the first voltage regulator and the second voltage regulator areconnected in series.
 4. The regulator circuit of claim 1, wherein thefirst voltage regulator and the second voltage regulator are connectedin parallel.
 5. The regulator circuit of claim 1, wherein the firstvoltage regulator includes a two-stage amplifier circuit to amplify thefirst input voltage in two stages.
 6. The regulator circuit of claim 1,wherein the second voltage regulator includes a-two-stage amplifiercircuit to amplify the second input voltage in two stages.
 7. Theregulator circuit of claim 1, wherein the second voltage regulatorincludes a pole-cancellation circuit.
 8. The regulator circuit of claim1, wherein the second voltage regulator includes a capacitor and aresistor, and wherein one end of the resistor is connected to thecapacitor and another end of the resistor is connected to a source ofthe NMOS.
 9. The regulator circuit of claim 1, wherein the first voltageregulator and the second voltage regulator are tunable to change adegree of input voltage regulation.
 10. The regulator circuit of claim1, wherein the first voltage regulator and the second voltage regulatorhave different input impedance and output impedance.
 11. A method by aregulator circuit, comprising: regulating, via a first voltageregulator, a first input voltage to the first voltage regulator, thefirst voltage regulator including a P-type metal-oxide-semiconductor(PMOS); regulating, via a second voltage regulator, a second inputvoltage to the second voltage regulator, the second voltage regulatorincluding an N-type metal-oxide-semiconductor (NMOS), wherein the firstvoltage regulator is connected to the second voltage regulator; andselectively activating, via a switch circuit, at least one of the firstvoltage regulator or the second voltage regulator.
 12. The method ofclaim 11, wherein the at least one of the first voltage regulator or thesecond voltage regulator is selectively activated based on noise.
 13. Aregulator circuit, comprising: means for regulating a first inputvoltage to the means for regulating the first input voltage, the meansfor regulating the first input voltage including a P-typemetal-oxide-semiconductor (PMOS); means for regulating a second inputvoltage to the means for regulating the second voltage, the means forregulating the second voltage including an N-typemetal-oxide-semiconductor (NMOS), wherein the means for regulating thefirst input voltage is connected to the means for regulating the secondvoltage; and means for selectively activating at least one of the meansfor regulating the first input voltage or the means for regulating thesecond voltage.
 14. The regulator circuit of claim 13, wherein the meansfor selectively activating is configured to selectively activate atleast one of the means for regulating the first input voltage or themeans for regulating the second voltage based on noise.